Die Attaching Machine Tender

Job Description

As a Die Attaching Machine Tender at TopTech Solutions, your primary responsibility will be operating and monitoring our state-of-the-art die attaching machines to attach dies to semiconductor packages. You will ensure machine efficiency and product quality in a fast-paced manufacturing environment.

Responsibilities

• Monitor die attaching processes to ensure adherence to quality standards.
• Conduct regular inspections and maintain accurate production records.
• Adjust and calibrate machinery and tools to optimize efficiency.
• Participate in team meetings and contribute to continuous improvement initiatives.
• Assist in training junior team members on best practices in machine operation.
• Evaluate production metrics and report discrepancies to supervisors.

Requirements

Education

• Technical degree or certification in manufacturing technology

Experience

• Preferred experience in semiconductor packaging processes.

Technical Skills

• Calibration skills
• Cleanroom protocols

Soft Skills

• Teamwork
• Adaptability

Languages

• English: Fluent

Advantageous

• Cleanroom environment experience: Experience working in cleanroom settings will be an advantage.
• Familiarity with quality inspection tools: Knowledge of tools used for quality assurance is preferred.

Benefits

• Comprehensive benefits package including health, dental, and vision insurance.
• 401(k) match program plus employee wellness initiatives.
• Paid time off and holidays.
• Support for continuous learning and training.

Company Culture

• Diversity and Inclusion: We aim to create a diverse workplace where different perspectives are valued.
• Continuous Improvement: We encourage our employees to pursue continuous improvement in their own skills and in our processes.
• Employee Recognition: We celebrate and recognize the contributions of our employees regularly to promote morale.